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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Advances in fine pitch lead free assembly process
Doraiswarni, R., Sankaxwaman, S., Woopoung Kim,, Jing Li,, Zhuqing Zhang,, Gupta, P., Nakanishi, K., Borkar, M., Madhavan, R., Govind, V., Suna Choi,, Aggarwal, A.O., Y. Sun,, Lianhua Fan,, SundYear:
2003
Language:
english
DOI:
10.1109/ectc.2003.1216386
File:
PDF, 525 KB
english, 2003