[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Reliability of 1206 capacitor/SAC305 solder joint reflowed in protective atmosphere
Tao, Yeqing, Ding, Dongyan, Li, Ting, Guo, Jason, He, Ted, Yu, YunhongYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922821
File:
PDF, 607 KB
english, 2014