[IEEE 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2013.10.27-2013.10.30)] 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems - Efficient performance evaluation of high-speed differential interconnect lines with via discontinuities
Kim, Hyewon, Lee, Junghyun, Eo, YungseonYear:
2013
Language:
english
DOI:
10.1109/epeps.2013.6703500
File:
PDF, 599 KB
english, 2013