[IEEE 2013 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Nara, Japan (2013.12.12-2013.12.15)] 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) - Development of decoupling capacitor embedded interposers using narrow gap chip parts mounting technology with wideband ultralow PDN impedance
Kikuchi, Katsuya, Aoyagi, Masahiro, Ujiie, Masaaki, Takayama, ShinyaYear:
2013
Language:
english
DOI:
10.1109/edaps.2013.6724444
File:
PDF, 721 KB
english, 2013