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[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Structural optimization of contact springs of electrical connectors using response surface methodology
Chen, Kun-Nan, Gau, Fu-Tsuen, Chu, Cheng-Chin, Cheng, Hsien-ChieYear:
2008
Language:
english
DOI:
10.1109/emap.2008.4784273
File:
PDF, 3.08 MB
english, 2008