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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Impact of wedge wire bonding and thermal mechanical stress on reliability of BPSG/poly layer of a silicon die
Yong Liu,, Irving, Scott, Timwah Luk,, Rioux, Mark, Qiuxiao Qian,Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550211
File:
PDF, 1.02 MB
english, 2008