![](/img/cover-not-exists.png)
[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF
Kumbhat, Nitesh, Choudhury, Abhishek, Raine, Melanie, Mehrotra, Gaurav, Raj, P. Markondeya, Zhang, Rongwei, Moon, Kyoung S., Chatterjee, Ritwik, Sundaram, Venky, Meyer-Berg, Georg, Wong, C. P., TummalYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074208
File:
PDF, 3.11 MB
english, 2009