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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - The impact of different under bump metallurgies and redistribution layers on the electromigration of solder balls for wafer-level packaging
Hau-Riege, Christine, Keser, Beth, Alvarado, Rey, Syed, Ahmer, Yau, YouWen, Bezuk, Steve, Caffey, KevinYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897438
File:
PDF, 2.91 MB
english, 2014