Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel...

IEEE Transactions on Electron Devices 2014 / 02 Vol. 61; Iss. 2

Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film

Fukushima, Takafumi, Bea, Jichoel, Kino, Hisashi, Nagai, Chisato, Murugesan, Mariappan, Hashiguchi, Hideto, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
61
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/ted.2013.2294831
Date:
February, 2014
File:
PDF, 3.36 MB
english, 2014
Conversion to is in progress
Conversion to is failed