[IEEE 2013 14th International Conference on Thermal,...

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Finite element analysis of fatigue cracks formation in power metallisation of a semiconductor device subjected to active cycling

Kravchenko, G., Karunamurthy, B., Nelhiebel, M., Pettermann, H. E.

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Year:

2013

Language:

english

DOI:

10.1109/eurosime.2013.6529951

File:

PDF, 1010 KB

english, 2013

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