![](/img/cover-not-exists.png)
[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Introducing FCA, a new alloy for Power Systems on a chip and Wafer Level Magnetic applications
Liakopoulos, Trifon, Panda, Amrit, Wilkowski, Matt, Lotfi, Ashraf, Tan, KH, Zhang, Li, Lai, Chiming, Chen, DongYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474765
File:
PDF, 1.45 MB
english, 2012