[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - An evaluation of electrografted copper seed layers for enhanced metallization of deep TSV structures
Ledain, S., Bunel, C., Mangiagalli, P., Carles, A., Frederich, N., Delbos, E., Omnes, L., Etcheberry, A.Year:
2008
Language:
english
DOI:
10.1109/iitc.2008.4546955
File:
PDF, 478 KB
english, 2008