Novel Microcontacts in Microwave Chip Carriers Developed by...

IEEE Transactions on Advanced Packaging 2006 / 08 Vol. 29; Iss. 3

Novel Microcontacts in Microwave Chip Carriers Developed by UV-Liga Process Part II

Arnaudov, R.A., Avdjiiski, B.A., Kostov, A.K., Videkov, V.V., Andreev, S.A., Yordanov, N.Y.
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2006.875411
Date:
August, 2006
File:
PDF, 4.99 MB
english, 2006
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