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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Optimization of stencil printing wafer bumping for fine pitch flip chip applications
Jing-Feng Gong,, Yau, E.W.C., Chan, P.C.H., Lee, R.S.W., Yuen, M.M.F.Year:
2003
Language:
english
DOI:
10.1109/ectc.2003.1216535
File:
PDF, 755 KB
english, 2003