[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Detection of cold joint defect in copper pillar bumps aided by underfill filler segregation phenomenon
Lee, Chien Chen, Hung, Li Chiun, Li, Pai Yuan, Hsieh, Ming-Che, Perng, Harry, Wang, VincentYear:
2011
DOI:
10.1109/impact.2011.6117222
File:
PDF, 1.55 MB
2011