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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Assembly process simulation of TSV interposer
Si, Chen, Fei, Qin, Guofeng, Xia, Wei, Wu, Daquan, Yu, Yuan, LuYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756461
File:
PDF, 299 KB
english, 2013