[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Electrothermal transport in carbon nanofiber interconnects
Yamada, Toshishige, Saito, Tsutomu, Fabris, Drazen, Yang, Cary Y.Year:
2009
Language:
english
DOI:
10.1109/ipfa.2009.5232679
File:
PDF, 1.54 MB
english, 2009