Sensitivity analysis of multiconductor transmission lines...

IEEE Transactions on Advanced Packaging 2000 / 5 Vol. 23; Iss. 2

Sensitivity analysis of multiconductor transmission lines and optimization for high-speed interconnect circuit design

Cheng Jiao,, Cangellaris, A.C., Yaghmour, A.M., Prince, J.L.
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Volume:
23
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.846623
Date:
May, 2000
File:
PDF, 192 KB
english, 2000
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