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[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - A Wafer-Level Packaging Approach for MEMS and Related Microsystems using Selective Laser-Assisted Bonding (LAB)
Mohan, A., O'Neal, C.B., Malshe, A.P., Foster, R.B.Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/ectc.2005.1441409
File:
PDF, 995 KB
english, 2005