Micro Cu Bump Interconnection on 3D Chip Stacking...

Japanese Journal of Applied Physics 2004 / 4 Vol. 43; Iss. 4B

Micro Cu Bump Interconnection on 3D Chip Stacking Technology

Tanida, Kazumasa, Umemoto, Mitsuo, Tanaka, Naotaka, Tomita, Yoshihiro, Takahashi, Kenji
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Volume:
43
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.43.2264
Date:
April, 2004
File:
PDF, 229 KB
english, 2004
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