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[IEEE Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium - Austin, TX, USA (28-30 Jan. 1997)] Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium - Thermal sub-modeling of the wirebonded plastic ball grid array package
Johnson, Z., Ramakrishna, K., Joiner, B., Eyman, M.Year:
1997
Language:
english
DOI:
10.1109/stherm.1997.566777
File:
PDF, 788 KB
english, 1997