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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Failure analysis of electroplating on sliver termination in multilayer ceramic capacitors (MLCCs)
Gui, Long, Bao, Shengxiang, Zhang, Xiaowen, Wang, Zuwen, Zhang, Chengshi, Shi, GuanghuaYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474820
File:
PDF, 1.29 MB
english, 2012