[IEEE International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Irvine, California, USA (March 16-18, 2005)] Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Effect of laser welding sequence on WIAD in packaging of dual-in-line laser modules
Yaomin Lin,, Shi, F.G.Year:
2005
Language:
english
DOI:
10.1109/isapm.2005.1432071
File:
PDF, 1.92 MB
english, 2005