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[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Development and characterization of low cost ultrathin 3D interconnect
Wei-Chung Lo,, Yu-Hua Chen,, Jeng-Dar Ko,, Tzu-Ying Kuo,, Chien-Wei Chien,, Yu-Chih Chen,, Wun-Yan Chen,, Fang-Jun Leu,, Hsu-Tien Hu,Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/ectc.2005.1441288
File:
PDF, 651 KB
english, 2005