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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Novel hermetic and low cost glass-capping technology for wafer-level-packaging of optical devices
Hansen, Ulli, Maus, Simon, Leib, Juergen, Toepper, MichaelYear:
2010
Language:
english
DOI:
10.1109/estc.2010.5642987
File:
PDF, 699 KB
english, 2010