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[IEEE APCCAS 2012-2012 IEEE Asia Pacific Conference on Circuits and Systems - Kaohsiung, Taiwan (2012.12.2-2012.12.5)] 2012 IEEE Asia Pacific Conference on Circuits and Systems - Simultaneous wafer bonding type selection and layer assignment for TSV count minimization
Cheng, Chun-Hua, Tzeng, Wei-Shuo, Huang, Shih-HsuYear:
2012
Language:
english
DOI:
10.1109/apccas.2012.6419113
File:
PDF, 399 KB
english, 2012