[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Development of micro-bump-bonded processes for 3DIC stacking with high throughput
Juang, Jing-Ye, Lu, Su-Tsai, Chung, Su-Ching, Cheng, Su-Mei, Lu, Yu-Lan, Peng, Jong-Shiou, Chen, Tai-HongYear:
2011
Language:
english
DOI:
10.1109/impact.2011.6117238
File:
PDF, 1.93 MB
english, 2011