[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Technology Options for Next-Generation High Pin Count RF Packaging
Polka, Lesley A., Hsu, Rockwell, Myers, Todd B., Chen, Jing H., Bao, AndyYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373919
File:
PDF, 4.94 MB
english, 2007