[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Wet etch recipe development for removing lead-free C4 bumps
Liu Qibin,, Zhao Xiaole,, Huang Weidong,, Chin, J.M.Year:
2009
Language:
english
DOI:
10.1109/ipfa.2009.5232631
File:
PDF, 5.75 MB
english, 2009