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[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Low temperature bonding studies of Au-studs and AuSn-solder bumps on Au-surface using ultrasonic energy
Aw, Jie Li, Lee, Jong Bum, Jaafar, Norhanani, Ding, Mian Zhi, Lim, Li-Shiah, Choong, Chong Ser, Rao, Vempati SrinivasaYear:
2013
Language:
english
DOI:
10.1109/eptc.2013.6745747
File:
PDF, 1.11 MB
english, 2013