[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - A combined fabrication methodology of the through wafer via for wl-package of GaAs image sensors
Ye, Jiaotuo, Wang, Shuangfu, Xu, Gaowei, Zhu, Chunsheng, Luo, LeYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474916
File:
PDF, 1.06 MB
english, 2012