An Application of the Thermal Network Method to the Thermal Analysis of Multichip Packages (Proposal of a Simple Thermal Analysis Model)
Fukuoka, Yoshitaka, Ishizuka, MasaruVolume:
28
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.28.1578
Date:
September, 1989
File:
PDF, 1.35 MB
1989