[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - From thin cores to outer layers: Filling through holes and blind micro vias with copper by reverse pulse plating
Kenny, Stephen, Roelfs, BerndYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270556
File:
PDF, 873 KB
english, 2009