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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Thermal simulation for the packaging structures of Radio frequency power amplifier chamber
Yanghai,, Yang, Daoguo, Jia, Yaoping, Jin, KeYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474720
File:
PDF, 866 KB
english, 2012