![](/img/cover-not-exists.png)
[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Formation and growth of intermetallic compounds of Sn-2Ag-2.5Zn on Cu and Ni substrates
Liu, Yucheng, Luo, Tingbi, Hu, Anmin, Li, Shangyuan, Wang, Weizhen, Li, MingYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474830
File:
PDF, 834 KB
english, 2012