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[IEEE 2006 IEEE Electrical Performane of Electronic Packaging - Scottsdale, AZ, USA (2006.10.23-2006.10.25)] 2006 IEEE Electrical Performane of Electronic Packaging - CPU Power Delivery Impedance Profile Resonances Impact on Core FMAX
Waizman, Alex, Vikinski, Omer, Sizikov, GregoryYear:
2006
Language:
english
DOI:
10.1109/epep.2006.321206
File:
PDF, 4.09 MB
english, 2006