[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - An experimental study of liquid jet impingement cooling of electronic components with and without boiling
Yang Cheng,, Tay, A.A.O., Xue Hong,Year:
2001
Language:
english
DOI:
10.1109/emap.2001.984012
File:
PDF, 686 KB
english, 2001