[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Gold-tin bonding for 200mm wafer level hermetic MEMS packaging
Garnier, A., Lagoutte, E., Baillin, X., Gillot, C., Sillon, N.Year:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898726
File:
PDF, 1.04 MB
english, 2011