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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Study of critical factors influencing the solidification undercooling behavior of Sn-3.0Ag-0.5Cu (SAC) lead-free solder and SAC/Cu joints
Li, Xun-Ping, Xia, Jian-Min, Qin, Hong-Bo, He, Xiao-Qi, Zhang, Xin-PingYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474633
File:
PDF, 1.09 MB
english, 2012