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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - The influence of low level doping of Ni on the microstructure and reliability of SAC solder joint
Zhenqing Zhao,, Lei Wang,, Xiaoqiang Xie,, Qian Wang,, Jaisung Lee,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607050
File:
PDF, 3.39 MB
english, 2008