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[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Post-Etch Cleaning for Porous Low K Integration: Impact of HF wet etch on "Pore-sealing" and "k recovery"
Broussous, L., Puyrenier, W., Rebiscoul, D., Rouessac, V., Ayral, A.Year:
2008
Language:
english
DOI:
10.1109/iitc.2008.4546933
File:
PDF, 579 KB
english, 2008