[IEEE 2007 International Conference on Thermal, Mechanical...

[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Kinetic Analysis of Electromigration Enhanced Intermetallic Growth and Void Formation in Pb-Free Solders

Chao, Brook, Chae, Seung-Hyun, Zhang, Xuefeng, Ho, Paul S.

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Year:

2007

Language:

english

DOI:

10.1109/esime.2007.360060

File:

PDF, 8.39 MB

english, 2007

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