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[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Kinetic Analysis of Electromigration Enhanced Intermetallic Growth and Void Formation in Pb-Free Solders
Chao, Brook, Chae, Seung-Hyun, Zhang, Xuefeng, Ho, Paul S.Year:
2007
Language:
english
DOI:
10.1109/esime.2007.360060
File:
PDF, 8.39 MB
english, 2007