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[IEEE 2008 IEEE Custom Integrated Circuits Conference - CICC 2008 - San Jose, CA, USA (2008.09.21-2008.09.24)] 2008 IEEE Custom Integrated Circuits Conference - Stacking technology based on 8-inch wafers using direct connection between TSV and micro-bump
Miyakawa, Nobuaki, Hashimoto, Eiri, Maebashi, Takanori, Nakamura, Natsuo, Sacho, Yutaka, Nakayama, Shigeto, Toyoda, ShinjiroYear:
2008
Language:
english
DOI:
10.1109/cicc.2008.4672169
File:
PDF, 1023 KB
english, 2008