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[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment
Unami, N., Noma, H., Sakuma, K., Shigetou, A., Shoji, S., Mizuno, J.Year:
2011
Language:
english
DOI:
10.1109/isapm.2011.6105704
File:
PDF, 702 KB
english, 2011