[IEEE 2009 11th Electronics Packaging Technology Conference...

  • Main
  • [IEEE 2009 11th Electronics Packaging...

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage

Shin, Ji-Won, Song, Min-Suk, Park, Yong-Sung, Kwon, Yong-Min, Moon, Jeong-Tak, Cho, Jong-Soo, Yoo, Kyung-Ah, Byun, Kwan-Yoo, Joh, Cheol-Ho, Do, Eun-Hye, Paik, Kyung-Wook
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416409
File:
PDF, 6.30 MB
english, 2009
Conversion to is in progress
Conversion to is failed