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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage
Shin, Ji-Won, Song, Min-Suk, Park, Yong-Sung, Kwon, Yong-Min, Moon, Jeong-Tak, Cho, Jong-Soo, Yoo, Kyung-Ah, Byun, Kwan-Yoo, Joh, Cheol-Ho, Do, Eun-Hye, Paik, Kyung-WookYear:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416409
File:
PDF, 6.30 MB
english, 2009