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[IEEE Proceedings of the IEEE 2006 International Interconnect Technology Conference - Burlingame, CA (2006.06.5-2006.06.7)] 2006 International Interconnect Technology Conference - Robust 45-nm Node Cu/LJLK Interconnects using Effective Porogen Control

Kagawa, Y., Enomoto, Y., Shimayama, T., Kameshima, T., Okamoto, M., Kawshima, H., Yamada, A., Hasegawa, T., Akiyama, K., Masuda, H., Miyajima, M., Shibata, H., Kadomura, S.
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Year:
2006
Language:
english
DOI:
10.1109/iitc.2006.1648689
File:
PDF, 1.21 MB
english, 2006
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