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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Dynamic properties testing of solders and modeling of electronic packages subjected to drop impact
Long Wen,, Xingming Fu,, Jianwei Zhou,, Qian Wang,, Jaisung Lee,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607133
File:
PDF, 1.80 MB
english, 2008