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Barrier technology for DyBa/sub 2/Cu/sub 3/O/sub 7-x/ junctions and related structures
Beauchamp, K.M., Zhang, Y.-J., Johnson, B.R., Schultz, R.K., Spalding, G.C., Tsen, M., Wang, T., Evans, J.F., Mecartney, M.L., Goldman, A.M.Volume:
27
Language:
english
Journal:
IEEE Transactions on Magnetics
DOI:
10.1109/20.133865
Date:
March, 1991
File:
PDF, 872 KB
english, 1991