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[IEEE 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2011.10.23-2011.10.26)] 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems - High-density silicon carrier transmission line design for chip-to-chip interconnects
Gu, Xiaoxiong, Turlapati, Lavanya, Dang, Bing, Tsang, Cornelia K., Andry, Paul S., Dickson, Timothy O., Beakes, Michael P., Knickerbocker, John U., Friedman, Daniel J.Year:
2011
Language:
english
DOI:
10.1109/epeps.2011.6100177
File:
PDF, 783 KB
english, 2011