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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Processing and reliability analysis of flip-chips with solder bumps down to 30 μm diameter
Franke, Jorg, Dohle, Rainer, Schusler, Florian, Oppert, Thomas, Friedrich, Thomas, Harter, StefanYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898617
File:
PDF, 1.40 MB
english, 2011